- Patent Title: Method to reduce particles during STI fill and reduce CMP scratches
-
Application No.: US14559268Application Date: 2014-12-03
-
Publication No.: US09721828B2Publication Date: 2017-08-01
- Inventor: Andrew Brian Nelson , Richard A. Stice , Joe Tran
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L21/02 ; H01L21/3105
Abstract:
A method of filling STI trenches with dielectric with reduced particle formation. A method of depositing unbiased STI oxide on an integrated circuit during STI trench fill that reduces STI defects during STI CMP.
Public/Granted literature
- US20150187635A1 METHOD TO REDUCE PARTICLES DURING STI FILL AND REDUCE CMP SCRATCHES Public/Granted day:2015-07-02
Information query
IPC分类:
