A thin film electronic component includes: a substrate; a thin film electrode layer over the substrate; an inorganic insulation layer formed on the thin film electrode layer; an organic insulation layer formed on the inorganic insulation layer; and a lead-out electrode that electrically connects to the thin film electrode layer. The inorganic insulation layer has a through-hole formed therein, so as to expose a portion of the thin film electrode layer. The organic insulation layer has a through-hole formed therein, so as to expose the through-hole in the inorganic insulation layer. The lead-out electrode is formed in the through-hole in the inorganic insulation layer and the through-hole in the organic insulation layer. A shape of a borderline defining the through-hole at a top surface of the organic insulation layer in a plan view has chamfered corners.