Invention Grant
- Patent Title: FinFETs having dielectric punch-through stoppers
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Application No.: US14988427Application Date: 2016-01-05
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Publication No.: US09722025B2Publication Date: 2017-08-01
- Inventor: Cheng-Hung Chang , Chen-Hua Yu , Chen-Nan Yeh
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L29/10 ; H01L21/8234 ; H01L27/088 ; H01L27/12 ; H01L29/78 ; H01L29/06

Abstract:
A semiconductor structure includes a semiconductor substrate; a planar transistor on a first portion of the semiconductor substrate, wherein the first portion of the semiconductor substrate has a first top surface; and a multiple-gate transistor on a second portion of the semiconductor substrate. The second portion of the semiconductor substrate is recessed from the first top surface to form a fin of the multiple-gate transistor. The fin is electrically isolated from the semiconductor substrate by an insulator.
Public/Granted literature
- US20160133703A1 FinFETs Having Dielectric Punch-Through Stoppers Public/Granted day:2016-05-12
Information query
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