Invention Grant
- Patent Title: Silicon carbide substrate, semiconductor device, and methods for manufacturing them
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Application No.: US15229694Application Date: 2016-08-05
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Publication No.: US09722028B2Publication Date: 2017-08-01
- Inventor: Keiji Ishibashi
- Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2012-083610 20120402
- Main IPC: H01L29/16
- IPC: H01L29/16 ; H01L29/32 ; H01L21/02 ; C30B29/36 ; C30B31/04 ; H01L29/66 ; H01L29/812 ; H01L29/04 ; H01L29/36 ; C30B23/02 ; H01L21/04

Abstract:
A silicon carbide substrate has a first main surface, and a second main surface opposite to the first main surface. A region including at least one main surface of the first and second main surfaces is made of single-crystal silicon carbide. In the one main surface, sulfur atoms are present at not less than 60×1010 atoms/cm2 and not more than 2000×1010 atoms/cm2, and carbon atoms as an impurity are present at not less than 3 at % and not more than 25 at %. Thereby, a silicon carbide substrate having a stable surface, a semiconductor device using the substrate, and methods for manufacturing them can be provided.
Public/Granted literature
- US20160343808A1 SILICON CARBIDE SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHODS FOR MANUFACTURING THEM Public/Granted day:2016-11-24
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