Invention Grant
- Patent Title: Method for manufacturing electronic device
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Application No.: US14385970Application Date: 2012-03-27
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Publication No.: US09722213B2Publication Date: 2017-08-01
- Inventor: Jun Sugahara , Hidetaka Ohazama , Shinsuke Tanaka , Hiromu Nara , Hiroki Tan
- Applicant: Jun Sugahara , Hidetaka Ohazama , Shinsuke Tanaka , Hiromu Nara , Hiroki Tan
- Applicant Address: JP Kawasaki-Shi, Kanagawa JP Tendo-Shi, Yamagata
- Assignee: PIONEER CORPORATION,TOHOKU PIONEER CORPORATION
- Current Assignee: PIONEER CORPORATION,TOHOKU PIONEER CORPORATION
- Current Assignee Address: JP Kawasaki-Shi, Kanagawa JP Tendo-Shi, Yamagata
- Agency: Procopio, Cory, Hargreaves & Savitch LLP
- International Application: PCT/JP2012/058014 WO 20120327
- International Announcement: WO2013/145139 WO 20131003
- Main IPC: H01L51/56
- IPC: H01L51/56 ; H01L51/52 ; B05D1/26 ; C23C16/455 ; H01L27/32 ; H01L23/31
Abstract:
When a coating film 4 is formed on a substrate 1, on which elements 3 are formed, by an ALD film forming method or the like, the coating film 4 is partially removed in a simple step. A method for manufacturing an electronic device includes a step of coating the substrate 1 partially with a partially coating member 2, a step of forming the elements 3 on the substrate 1, a step of forming the coating film 4 on the substrate 1 to cover the elements 3 and the partially coating member 2, and a step of forming a crack 4A in the coating film 4 on the partially coating member 2.
Public/Granted literature
- US20150079708A1 METHOD FOR MANUFACTURING ELECTRONIC DEVICE Public/Granted day:2015-03-19
Information query
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