Invention Grant
- Patent Title: Power inlet socket for providing power to electronic device
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Application No.: US15193298Application Date: 2016-06-27
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Publication No.: US09722331B2Publication Date: 2017-08-01
- Inventor: Sung-yong Joo , Jin-hyung Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2015-0111095 20150806
- Main IPC: H01R9/24
- IPC: H01R9/24 ; H01R13/648 ; H01R24/76 ; H01R103/00

Abstract:
A power inlet socket coupled to a power delivering member of an electronic device to supply power from an external power plug to the electronic device includes a socket body comprising a power plug connector connected to the external power plug and a power delivering member connector connected to the power delivering member; three terminal pins, each terminal pin comprises a projecting pin extending from the power plug connector in parallel with one another to correspond to a terminal of the external power plug and a connection terminal exposed to the power delivering member connector; and an insulating barrier provided between at least a pair of connection terminals of the three terminal pins to cut off an electric current flowing among the connection terminals. Thus, the insulating distance of power inlet socket is improved.
Public/Granted literature
- US20170040744A1 POWER INLET SOCKET FOR PROVIDING POWER TO ELECTRONIC DEVICE Public/Granted day:2017-02-09
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