Invention Grant
- Patent Title: Semiconductor chip and solar system
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Application No.: US14950167Application Date: 2015-11-24
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Publication No.: US09722457B2Publication Date: 2017-08-01
- Inventor: Kikuo Utsuno
- Applicant: Lapis Semiconductor Co., Ltd.
- Applicant Address: JP Yokohama
- Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee: LAPIS SEMICONDUCTOR CO., LTD.
- Current Assignee Address: JP Yokohama
- Agency: Volentine & Whitt, PLLC
- Priority: JP2010-266297 20101130
- Main IPC: H02J7/35
- IPC: H02J7/35 ; H01L23/64 ; H02J7/00

Abstract:
There is provided a semiconductor chip having four sides and being substantially formed in a rectangle, the semiconductor chip including: a first terminal which is located along one side of the four sides of the semiconductor chip and which is to be electrically connected to a solar cell outside the semiconductor chip; a second terminal which is located along the one side of the semiconductor chip and which is to be electrically connected to a secondary cell outside the semiconductor chip; and an interconnection line that electrically interconnects the first terminal and the second terminal.
Public/Granted literature
- US20160079806A1 SEMICONDUCTOR CHIP AND SOLAR SYSTEM Public/Granted day:2016-03-17
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