Invention Grant
- Patent Title: Interleaved coil and ferrite configuration to facilitate near field coupling
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Application No.: US13976078Application Date: 2011-12-21
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Publication No.: US09722673B2Publication Date: 2017-08-01
- Inventor: Songnan Yang , Emily B. Cooper , Ronald W. Gallahan , Adam D. Rea
- Applicant: Songnan Yang , Emily B. Cooper , Ronald W. Gallahan
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schiff Hardin LLP
- International Application: PCT/US2011/066455 WO 20111221
- International Announcement: WO2013/095428 WO 20130627
- Main IPC: H04B5/00
- IPC: H04B5/00 ; H01Q1/24 ; H01Q7/06
Abstract:
Described herein are techniques related to near field coupling (e.g., wireless power transfers (WPF) and near field communications (NFC)) operations among others. This Abstract is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
Public/Granted literature
- US20160119036A1 INTERLEAVED COIL AND FERRITE CONFIGURATION TO FACILITATE NEAR FIELD COUPLING Public/Granted day:2016-04-28
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