The exemplary embodiment of the present disclosure relates to a camera module including a rear-opened front body, a rear body coupled to a rear side of the front body to form an inner space, a lens part coupled to the front body, an image sensor accommodated at the inner space to convert a light having passed the lens part to an electrical signal, a PCB (Printed Circuit Board) accommodated at the inner space and mounted with the image sensor, and a closed curve-shaped packing member interposed between the front body and the rear body, wherein the packing member includes a support part extensively formed from the packing member to an inner side, and the front body or the rear body includes a support part accommodation groove having a shape corresponding to that of the support part, whereby adhesionability during assembly of packing member can be maximized to thereby minimize an installation defect, a depressed or stamped phenomenon of a packing member that may occur during assembly process.