Invention Grant
- Patent Title: Power module substrate, power module substrate with heatsink, power module, and method for producing power module substrate
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Application No.: US14388051Application Date: 2013-03-29
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Publication No.: US09723707B2Publication Date: 2017-08-01
- Inventor: Nobuyuki Terasaki , Yoshiyuki Nagatomo , Yoshirou Kuromitsu
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Agent James E. Armstrong, IV; Nicholas J. DiCeglie, Jr.
- Priority: JP2012-083249 20120330; JP2012-203362 20120914
- International Application: PCT/JP2013/059500 WO 20130329
- International Announcement: WO2013/147144 WO 20131003
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/09 ; H05K1/18 ; H05K3/10 ; H01L23/373 ; B23K20/02 ; B23K20/233 ; C04B37/02 ; H01L23/473 ; B23K103/10 ; B23K103/12 ; H01L23/00
Abstract:
A power module substrate includes a circuit layer, an aluminum layer arranged on a surface of an insulation layer, and a copper layer laminated on one side of the aluminum layer. The aluminum layer and the copper layer are bonded together by solid phase diffusion bonding.
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