A multi-layered electronic system has: a support substrate which supports at least a primary conductive track and a conductive shorting element, which are electrical isolated from one another. A security layer has at least a conductive security connection and a flexible switch element providing an electrical interruption to the conductive security track. The conductive security connection electrically engages the primary conductive track. The flexible switch element is coplanar with the conductive security connection. A dielectric substrate, to which the security layer is affixed, is secured to the support substrate. The electrical interruption of the conductive security connection is bridged by the switch element contacting the conductive shorting element under an actuation force provided from the direction of the dielectric substrate, the switch element being biased away from the conductive shorting element in the absence of the actuation force.