Invention Grant
- Patent Title: Electronic component mounting device and semiconductor device including the same
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Application No.: US14452785Application Date: 2014-08-06
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Publication No.: US09723718B2Publication Date: 2017-08-01
- Inventor: Taichi Obara , Rei Yoneyama , Takami Otsuki , Eiju Shitama
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Studebaker & Brackett PC
- Priority: JP2013-253978 20131209
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/11 ; H01L23/15 ; H05K3/34 ; H05K7/12 ; H05K7/00 ; H01L23/13 ; H01L23/373 ; H01L23/498
Abstract:
An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.
Public/Granted literature
- US20150163916A1 ELECTRONIC COMPONENT MOUNTING DEVICE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME Public/Granted day:2015-06-11
Information query
