Invention Grant
- Patent Title: Heat dissipating system
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Application No.: US14277807Application Date: 2014-05-15
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Publication No.: US09723752B2Publication Date: 2017-08-01
- Inventor: Chang-Hsu Yen , Chien-Yu Lin
- Applicant: Chang-Hsu Yen , Chien-Yu Lin
- Applicant Address: TW Taipei
- Assignee: ASUSTeK COMPUTER INC.
- Current Assignee: ASUSTeK COMPUTER INC.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW102117397A 20130516
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F04B43/04 ; F04B45/047 ; F04F7/00

Abstract:
A heat dissipating system including a casing body, a heat source and a piezoelectric fan is provided. The casing body includes an upper casing and a bottom case, wherein at least one of the upper casing and the bottom casing includes at least one air inlet. The heat source and the piezoelectric fan are both disposed in the casing body. The piezoelectric fan has an opening facing the heat source while the air inlet is adjacent to the opening. Air is adsorbed into the opening through the air inlet and is exhausted out towards a direction of the heat source by the piezoelectric fan.
Public/Granted literature
- US20140338868A1 HEAT DISSIPATING SYSTEM Public/Granted day:2014-11-20
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