- Patent Title: Airflow channeling structure for densely packed storage enclosures
-
Application No.: US14612434Application Date: 2015-02-03
-
Publication No.: US09723758B2Publication Date: 2017-08-01
- Inventor: Haesung Kwon , Austin Michael Shelnutt , Walt Carver
- Applicant: DELL PRODUCTS, L.P.
- Applicant Address: US TX Round Rock
- Assignee: Dell Products, L.P.
- Current Assignee: Dell Products, L.P.
- Current Assignee Address: US TX Round Rock
- Agency: Isidore PLLC
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/20 ; G11B33/12 ; G11B33/14

Abstract:
A chassis directs cooling air around compute components of an information handling system (IHS). The chassis includes an enclosure having a base wall, an air intake at a front side, and an air exhaust at a rear side. Stiffeners are attached laterally across the base wall and positioned between the front side and a rear area of the base wall. A planar member is horizontally attached on top of the one or more stiffeners. The planar member is provisioned with the compute components, which substantially block air flow above the planar member causing thermal shadowing of the thermal energy generating component that is provisioned in the rear area. Air channels formed through each of the stiffeners direct air flow under the planar member toward the rear area that is provisioned with the thermal energy generating component.
Public/Granted literature
- US20160227669A1 AIRFLOW CHANNELING STRUCTURE FOR DENSELY PACKED STORAGE ENCLOSURES Public/Granted day:2016-08-04
Information query