A system for applying a material to a substrate comprising: a feed section that comprises a feed roll and configured for advancing a material along a predetermined path; a material applicator roll configured to receive the material from the feed roll and apply a cut length of material to a substrate; a knife element located between the feed section and the material applicator roll; and a non-vacuum anvil roll positioned near the knife element, wherein the knife element and the non-vacuum anvil roll are positioned along the path of the material and engage the material to cut the material into the cut length of material for applying to the substrate, and wherein the material contacts the peripheral surface of the non-vacuum anvil roll only at a cut engagement point.