Invention Grant
- Patent Title: High-frequency component and high-frequency module including the same
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Application No.: US14883792Application Date: 2015-10-15
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Publication No.: US09743519B2Publication Date: 2017-08-22
- Inventor: Kiyofumi Takai , Hidenori Obiya , Shinya Hitomi
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2013-085383 20130416
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/14 ; H01L23/12 ; H01L23/13 ; H01L23/29 ; H01L23/31 ; H01L23/498 ; H05K1/02 ; H05K1/11 ; H01L23/552 ; H01L23/538 ; H01L23/66 ; H01L23/00 ; H01L23/24

Abstract:
A filter circuit component includes desired frequency characteristics without being influenced by a parasitic inductance and a parasitic capacitance, and since the ground terminal of the filter circuit component connected to the mounting electrode of the high-frequency component is connected to the ground electrode of the high-frequency component through the via conductors of the high-frequency component at the shortest distance, the packing density of the filter circuit component is significantly increased and the occurrence of an unnecessary parasitic inductance and an unnecessary parasitic capacitance is prevented. The filter circuit component is mounted on the high-frequency component to obtain the desired frequency characteristics without the influence of a parasitic inductance and a parasitic capacitance. Since the component is located in a space surrounded by the inner peripheral surface of the supporting frame body, the packing density of components mounted on the high-frequency component is increased.
Public/Granted literature
- US20160037640A1 HIGH-FREQUENCY COMPONENT AND HIGH-FREQUENCY MODULE INCLUDING THE SAME Public/Granted day:2016-02-04
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