Invention Grant
- Patent Title: Cooled hot melt adhesive storage systems, and related methods
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Application No.: US14524457Application Date: 2014-10-27
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Publication No.: US09744553B2Publication Date: 2017-08-29
- Inventor: Wesley C. Fort , Laurence B. Saidman , Sang Hyub Shin , Raymond L. Townsend , Leslie J. Varga
- Applicant: Nordson Corporation
- Applicant Address: US OH Westlake
- Assignee: Nordson Corporation
- Current Assignee: Nordson Corporation
- Current Assignee Address: US OH Westlake
- Agency: Baker & Hostetler LLP
- Main IPC: F25D17/00
- IPC: F25D17/00 ; B05C11/10
Abstract:
A cooled hot melt adhesive material storage system includes a bin and a cooling unit. The bin receives and holds a supply of hot melt adhesive pieces, and includes an outlet for communicating hot melt adhesive pieces to a melter device. The cooling unit is operatively coupled with the bin, and is configured for cooling hot melt adhesive pieces contained in the bin.
Public/Granted literature
- US20150114989A1 COOLED HOT MELT ADHESIVE STORAGE SYSTEMS, AND RELATED METHODS Public/Granted day:2015-04-30
Information query
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