Invention Grant
- Patent Title: Wafer taping scheme
-
Application No.: US14093221Application Date: 2013-11-29
-
Publication No.: US09748130B2Publication Date: 2017-08-29
- Inventor: Wen-Ming Chen , Wei-Chih Chen , Tung-Hsiao Yu , Min-Yu Wu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/683 ; H01L21/67
Abstract:
A method includes setting a first tension value of a laminating tape during a standby mode. A second tension value of the laminating tape is set during taping on a wafer. The second tension value is different from the first tension value. A third tension value of the laminating tape is set after taping. The third tension value is different from the second tension value.
Public/Granted literature
- US20150155195A1 Wafer Taping Scheme Public/Granted day:2015-06-04
Information query
IPC分类:
