Invention Grant
- Patent Title: Bonded dies with isolation
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Application No.: US15386867Application Date: 2016-12-21
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Publication No.: US09748207B2Publication Date: 2017-08-29
- Inventor: Norbert Krause , Yashodhan Vijay Moghe
- Applicant: THE SILANNA GROUP PTY LTD
- Applicant Address: AU Eight Mile Plains, Queensland
- Assignee: The Silanna Group Pty Ltd
- Current Assignee: The Silanna Group Pty Ltd
- Current Assignee Address: AU Eight Mile Plains, Queensland
- Agency: The Mueller Law Office, P.C.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L25/065 ; H01L25/00 ; H01L23/00
Abstract:
An electronic circuit structure is formed with first and second dies bonded together. A first active layer is formed in the first die, and a second active layer is formed in the second die. The first and second dies are bonded together, with an isolation capacitor, through which the first and second active layers communicate, disposed between the first and second dies.
Public/Granted literature
- US20170103969A1 Bonded Dies with Isolation Public/Granted day:2017-04-13
Information query
IPC分类:
