Invention Grant
- Patent Title: Semiconductor device structure and method for forming the same
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Application No.: US14668519Application Date: 2015-03-25
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Publication No.: US09748232B2Publication Date: 2017-08-29
- Inventor: Ming-Chang Lee , Chung-Tsun Sun , Chia-Der Chang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/768 ; H01L23/485 ; H01L27/02 ; H01L21/265 ; H01L29/66 ; H01L29/78 ; H01L29/165 ; H01L21/285 ; H01L21/8234

Abstract:
A semiconductor device structure is provided. The semiconductor device structure includes a substrate having a first source region and a first drain region. The semiconductor device structure includes a first gate over the substrate and between the first source region and the first drain region. The semiconductor device structure includes a first contact structure over the first source region. The first contact structure is electrically connected to the first source region. The semiconductor device structure includes a second contact structure over the first drain region. The second contact structure is electrically connected to the first drain region. The semiconductor device structure includes a conductive layer electrically connecting the first gate to the first contact structure and the second contact structure.
Public/Granted literature
- US20160190124A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME Public/Granted day:2016-06-30
Information query
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