Invention Grant
- Patent Title: Semiconductor structure and method of forming the same
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Application No.: US14926783Application Date: 2015-10-29
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Publication No.: US09748372B2Publication Date: 2017-08-29
- Inventor: King-Yuen Wong , Chen-Ju Yu , Fu-Wei Yao , Chun-Wei Hsu , Jiun-Lei Jerry Yu , Chih-Wen Hsiung , Fu-Chih Yang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/51 ; H01L29/66 ; H01L21/28 ; H01L29/20 ; H01L29/207

Abstract:
A method of forming a semiconductor structure includes growing a second III-V compound layer over a first III-V compound layer, wherein the second III-V compound layer has a different band gap from the first III-V compound layer. The method further includes forming a source feature and a drain feature over the second III-V compound layer. The method further includes forming a gate dielectric layer over the second III-V compound layer, the source feature and the drain feature. The method further includes implanting at least one fluorine-containing compound into a portion of the gate dielectric layer. The method further includes forming a gate electrode over the portion of the gate dielectric layer.
Public/Granted literature
- US20160049505A1 SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2016-02-18
Information query
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