Invention Grant
- Patent Title: Sensor assembly
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Application No.: US15303549Application Date: 2014-04-30
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Publication No.: US09748995B2Publication Date: 2017-08-29
- Inventor: Chun Chih Chen , Hung-Wen Cheng
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Patent Department
- International Application: PCT/US2014/036100 WO 20140430
- International Announcement: WO2015/167514 WO 20151105
- Main IPC: H04B1/3827
- IPC: H04B1/3827 ; G01D5/24 ; H04M1/02 ; H04W52/28
Abstract:
A sensor assembly is provided for a portable electronic device. The sensor assembly includes a proximity sensor and a module including shielding. The proximity sensor is connected to the shielding such that the shielding selectively functions as a sensor electrode for the proximity sensor.
Public/Granted literature
- US20170041035A1 SENSOR ASSEMBLY Public/Granted day:2017-02-09
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