Invention Grant
- Patent Title: Folding headset earpiece
-
Application No.: US14743642Application Date: 2015-06-18
-
Publication No.: US09749727B2Publication Date: 2017-08-29
- Inventor: Erik Henry Tews , John Kelley , Jacob T Meyberg , Roman M Duran
- Applicant: Plantronics, Inc.
- Applicant Address: US CA Santa Cruz
- Assignee: Plantronics, Inc.
- Current Assignee: Plantronics, Inc.
- Current Assignee Address: US CA Santa Cruz
- Main IPC: H04R25/00
- IPC: H04R25/00 ; H04R1/10
Abstract:
A headset earpiece comprises a faceplate; and at least one flange pivotably connected to the faceplate.
Public/Granted literature
- US20160373848A1 Folding Headset Earpiece Public/Granted day:2016-12-22
Information query
