Invention Grant
- Patent Title: Miniature SMT housing for electronics package
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Application No.: US15172744Application Date: 2016-06-03
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Publication No.: US09750139B2Publication Date: 2017-08-29
- Inventor: Brent Salamone
- Applicant: CIRCOR AEROSPACE, INC.
- Applicant Address: US NY Hauppauge
- Assignee: Circor Aerospace, Inc.
- Current Assignee: Circor Aerospace, Inc.
- Current Assignee Address: US NY Hauppauge
- Agency: McNees Wallace & Nurick LLC
- Main IPC: H05K1/18
- IPC: H05K1/18

Abstract:
A housing, for surface-mount technology (SMT), accepts any electronics package that is mounted on a circular substrate. The housing including the assembled electronics package forms an SMT housing assembly. The SMT housing assembly is placed directly onto the surface of a printed circuit board (PCB). The SMT housing assembly is soldered to the PCB using standard soldering techniques, establishing an electrical connection between the electronics package and the PCB.
Public/Granted literature
- US20160374214A1 MINIATURE SMT HOUSING FOR ELECTRONICS PACKAGE Public/Granted day:2016-12-22
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