Invention Grant
- Patent Title: Interchangeable internal modular avionics platform assembly
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Application No.: US14919663Application Date: 2015-10-21
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Publication No.: US09750162B2Publication Date: 2017-08-29
- Inventor: Kenneth Alan Szarek
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Kolisch Hartwell, P.C.
- Main IPC: H05K7/20
- IPC: H05K7/20 ; B64D47/00 ; H05K7/14 ; B64C1/00 ; H05K7/18 ; H01R27/02 ; G08C17/02 ; H04L29/08 ; H04W84/18

Abstract:
Internal interchangeable modular avionics platform assemblies and methods for removably mounting and interchanging modular avionics platforms within an aircraft. In some embodiments, modular avionics platform assemblies may include a modular avionics platform configured to support various avionics equipment, suitable for removable mounting within a forward fuselage, and interchangeable with a number of alternate platforms. A platform may include a frame structure, and mounting pins and a connector assembly disposed on the frame structure. The mounting pins may project outwardly from the frame structure to align with and detachably secure to corresponding airframe members of an aircraft when the frame structure is in a mounted position. The connector assembly may be disposed on the frame structure and have a plurality of connectors, including connectors for alternating current, direct current, and data. In some embodiments, the platform may also include an environmental cooling system disposed on the frame structure.
Public/Granted literature
- US20170118873A1 INTERCHANGEABLE INTERNAL MODULAR AVIONICS PLATFORM ASSEMBLY Public/Granted day:2017-04-27
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