Invention Grant
- Patent Title: High-frequency-vibration-assisted electrolytic grinding method and device therefor
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Application No.: US14400482Application Date: 2013-04-12
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Publication No.: US09751142B2Publication Date: 2017-09-05
- Inventor: Toru Tachibana , Satoshi Kobayashi , Masayuki Takahashi , Chikashi Murakoshi , Kazunori Koike
- Applicant: Micron Machinery Co., LTD
- Applicant Address: JP Yamagata
- Assignee: MICRON MACHINERY CO., LTD
- Current Assignee: MICRON MACHINERY CO., LTD
- Current Assignee Address: JP Yamagata
- Agent Bryant J. Keller; Kirton McConkie
- Priority: JP2012-155396 20120711
- International Application: PCT/JP2013/002519 WO 20130412
- International Announcement: WO2014/010152 WO 20140116
- Main IPC: B23H5/08
- IPC: B23H5/08 ; C25F3/02 ; C25F7/00

Abstract:
To provide a high-frequency-vibration-assisted electrolytic grinding method and a device therefor in which micro abrasive grains can be used so as to improve the grinding accuracy and efficiency. A high-frequency-vibration-assisted electrolytic grinding method in which a work is grinded by a grinding stone while electrolytic reaction is performed by applying a voltage between the grinding stone and the work through an electrolytic solution and high-frequency vibration is transmitted to the grinding stone or the work wherein; the grinding stone has non-conductive micro abrasive grains with grain sizes of less than #400 in accordance with the JIS R6001 standard of grinding stones for precision polishing projecting from its surface formed of conductive binding material, and the distance between the grinding stone and the work, which is regulated by the projecting lengths of the micro abrasive grains from the base of the grinding stone, is set to less than 0.02 mm.
Public/Granted literature
- US20150231718A1 HIGH-FREQUENCY-VIBRATION-ASSISTED ELECTROLYTIC GRINDING METHOD AND DEVICE THEREFOR Public/Granted day:2015-08-20
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