A substrate de-bowing mechanism, system and method are described. The mechanism can include a substrate support, one or more stationary contact members, and one or more dynamic or movable contact members that are adapted to contact the substrate and bend the substrate in a desired direction to reduce or eliminate bowing of the substrate. The mechanism is controlled by a CPU or other controller that can adjust the de-bow parameters of the de-bowing mechanism based on input settings that can be dynamic and/or static settings. The mechanism can be used to de-bow a variety of substrates including plastic cards, passports, and passport pages.