Invention Grant
- Patent Title: Device and method for processing wafers
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Application No.: US13878570Application Date: 2011-10-05
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Publication No.: US09751698B2Publication Date: 2017-09-05
- Inventor: Friedrich Paul Lindner , Peter-Oliver Hangweier
- Applicant: Friedrich Paul Lindner , Peter-Oliver Hangweier
- Applicant Address: AT St. Florian am Inn
- Assignee: EV GROUP GMBH
- Current Assignee: EV GROUP GMBH
- Current Assignee Address: AT St. Florian am Inn
- Agency: Kunsner & Jaffe
- Priority: DE102010048043 20101015
- International Application: PCT/EP2011/067405 WO 20111005
- International Announcement: WO2012/049058 WO 20120419
- Main IPC: H01L21/02
- IPC: H01L21/02 ; B65G47/00 ; H01L21/67
Abstract:
The invention relates to a device for processing of substrates, especially wafers, with at least one pretreatment module, at least one aftertreatment module and at least one primary treatment module, and the pretreatment module and the aftertreatment module can be switched as a lock for the primary treatment module, and a corresponding method for processing of substrates, especially wafers.
Public/Granted literature
- US20130240113A1 DEVICE AND METHOD FOR PROCESSING WAFERS Public/Granted day:2013-09-19
Information query
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