Frit sealing system
Abstract:
Provided is a frit sealing system for attaching a first substrate and a second substrate by using a frit. The frit sealing system includes a laser irradiation member configured to irradiate a laser on the frit between the first substrate and the second substrate, and a pressurization member on the second substrate, the pressurization member being configured to apply pressure to the second substrate during the irradiation of the laser, the pressurization member including base, and an elastic portion connected to the base and contacting the second substrate.
Public/Granted literature
Information query
Patent Agency Ranking
0/0