- Patent Title: Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition
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Application No.: US14654758Application Date: 2013-12-19
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Publication No.: US09751984B2Publication Date: 2017-09-05
- Inventor: Tetsuya Enomoto , Keishi Ono , Masayuki Ohe , Keiko Suzuki , Kazuya Soejima , Etsuharu Suzuki
- Applicant: Hitachi Chemical DuPont MicroSystems, Ltd.
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
- Current Assignee: HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Griffin and Szipl PC
- Priority: JP2012-279343 20121221
- International Application: PCT/JP2013/007467 WO 20131219
- International Announcement: WO2014/097633 WO 20140626
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G03F7/037 ; G03F7/031 ; C08G73/10 ; C08G73/16 ; C08K5/33 ; G03F7/16 ; G03F7/20 ; G03F7/32 ; G03F7/40 ; C08F290/14 ; H01L21/02 ; H01L21/311 ; C09D179/08
Abstract:
A polyimide precursor including a structural unit represented by the following general formula (1) in a ratio of 50 mol % or more based on the total structural units. In the general formula (1), A is a tetravalent organic group represented by the following general formula (2a), a tetravalent organic group represented by the following general formula (2b), or a tetravalent organic group represented by the following general formula (2c), and B is a divalent organic group represented by the following general formula (3).
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