- Patent Title: Condensation curable resin composition and semiconductor package
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Application No.: US15361537Application Date: 2016-11-28
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Publication No.: US09751989B2Publication Date: 2017-09-05
- Inventor: Takayuki Kusunoki
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP2015-249522 20151222; JP2016-028902 20160218
- Main IPC: H01L23/29
- IPC: H01L23/29 ; C08G77/52
Abstract:
A condensation curable resin composition comprising a silphenylene oligomer skeleton-bearing organosilicon compound having at least two hydroxyl and/or alkoxy groups per molecule cures into a product having both a satisfactory hardness and crack resistance.
Public/Granted literature
- US20170174843A1 CONDENSATION CURABLE RESIN COMPOSITION AND SEMICONDUCTOR PACKAGE Public/Granted day:2017-06-22
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