Invention Grant
- Patent Title: Polyamide resin composition and molded article
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Application No.: US14972847Application Date: 2015-12-17
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Publication No.: US09752006B2Publication Date: 2017-09-05
- Inventor: Teruaki Sakuma , Kazunori Terada
- Applicant: ASAHI KASEI CHEMICALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ASAHI KASEI KABUSHIKI KAISHA
- Current Assignee: ASAHI KASEI KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2014-256479 20141218
- Main IPC: C08K3/16
- IPC: C08K3/16 ; C08K5/17 ; C08K5/098 ; C08K3/00
Abstract:
A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and a secondary amine compound (D).
Public/Granted literature
- US20160177049A1 POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE Public/Granted day:2016-06-23
Information query
