Invention Grant
- Patent Title: Polyamic acid and polyimide, processes for the production of same, compositions containing same, and uses thereof
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Application No.: US13203343Application Date: 2010-02-26
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Publication No.: US09752030B2Publication Date: 2017-09-05
- Inventor: Kenichi Fukukawa , Masaki Okazaki , Yoshihiro Sakata , Ichiro Fujio , Wataru Yamashita
- Applicant: Kenichi Fukukawa , Masaki Okazaki , Yoshihiro Sakata , Ichiro Fujio , Wataru Yamashita
- Applicant Address: JP Tokyo
- Assignee: MITSUI CHEMICALS, INC.
- Current Assignee: MITSUI CHEMICALS, INC.
- Current Assignee Address: JP Tokyo
- Agency: Buchanan, Ingersoll & Rooney PC
- Priority: JP2009-051102 20090304
- International Application: PCT/JP2010/001332 WO 20100226
- International Announcement: WO2010/100874 WO 20100910
- Main IPC: C08L79/08
- IPC: C08L79/08 ; B32B15/08 ; B32B15/20 ; B32B27/34 ; B32B27/36 ; C09D179/08 ; C08G73/10 ; H05K1/03
Abstract:
The purpose of the present invention is to provide a polyimide resin which exhibits higher heat resistance than that of a conventional polyimide resin by controlling the geometric configuration of the constituent units. Provided is a polyamic acid which comprises repeating units represented by general formula (1), wherein the 1,4-bismethylenecyclohexane skeleton units consist of both trans- and cis-form units, and the contents of the trans- and cis-form units are 60 to 100% and 0 to 40% respectively (with the sum total of the trans- and cis-form units being 100%).
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