Hot melt pressure sensitive adhesive and thermoset comprising styrene-butadiene polymers having high vinyl and high di-block
Abstract:
The present invention provides methods and systems for a hot melt pressure sensitive adhesive and thermoset that comprises from about 5 to about 50 wt. % of a block copolymer, from about 0 to about 75 wt. % of a tackifying resin, from about 0 to about 45 wt. % of an oil, and from about 0 to about 3 wt. % of an antioxidant.
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