Invention Grant
- Patent Title: Sensor structures, systems and methods with improved integration and optimized footprint
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Application No.: US14498584Application Date: 2014-09-26
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Publication No.: US09752943B2Publication Date: 2017-09-05
- Inventor: Thoralf Kautzsch , Heiko Froehlich , Mirko Vogt , Maik Stegemann , Andre Röth , Bernhard Winkler , Boris Binder
- Applicant: Infineon Technologies Dresden GmbH
- Applicant Address: DE Dresden
- Assignee: Infineon Technologies Dresden GmbH
- Current Assignee: Infineon Technologies Dresden GmbH
- Current Assignee Address: DE Dresden
- Agency: Schiff Hardin LLP
- Main IPC: G01L9/00
- IPC: G01L9/00 ; B81B3/00

Abstract:
Embodiments relate to sensors and more particularly to structures for and methods of forming sensors that are easier to manufacture as integrated components and provide improved deflection of a sensor membrane, lamella or other movable element. In embodiments, a sensor comprises a support structure for a lamella, membrane or other movable element. The support structure comprises a plurality of support elements that hold or carry the movable element. The support elements can comprise individual cylindrical points or feet-like elements with straight or concave sidewalls, rather than a conventional interconnected frame, that enable improved motion of the movable element, easier removal of a sacrificial layer between the movable element and substrate during manufacture and a more favorable deflection ratio, among other benefits.
Public/Granted literature
- US20150210535A1 SENSOR STRUCTURES, SYSTEMS AND METHODS WITH IMPROVED INTEGRATION AND OPTIMIZED FOOTPRINT Public/Granted day:2015-07-30
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