In a display device that a terminal of a display panel is connected to bumps of the driver IC via an ACF, the driver IC includes input-side and output-side bump arrays arranged along mutually facing long sides. In configurations of the driver IC, a width A of a short side thereof ≧1.45 mm, a thickness thereof B ≦0.20 mm, a dimension C between input-side and output-side bumps ≧1.10 mm, a length D of each bump ≧98 μm, a minimum dimension F between the bumps ≦15 μm, a number of arrays G of the output-side bump ≧2 (two arrays) and a particle size E of a conductive particle contained in the anisotropic conductive film ≦3.5 μm, not more than six configurations are included.