Invention Grant
- Patent Title: Edge bead removal apparatus
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Application No.: US15369075Application Date: 2016-12-05
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Publication No.: US09753371B2Publication Date: 2017-09-05
- Inventor: Yang Liu , Qiang Wu
- Applicant: Semiconductor Manufacturing International (Shanghai) Corporation
- Applicant Address: CN Shanghai
- Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
- Current Assignee Address: CN Shanghai
- Agency: Anova Law Group, PLLC
- Priority: CN201310222206 20130605
- Main IPC: B08B3/02
- IPC: B08B3/02 ; B08B3/08 ; B08B5/02 ; G03F7/42 ; H01L21/02 ; H01L21/67 ; B08B3/04 ; F26B21/00
Abstract:
An edge bead removal apparatus is provided. The edge bead removal apparatus includes a clamping unit configured to clamp a cylindrical reticle and cause the cylindrical reticle to incline with a pre-determined angle and to rotate around a central axis. The edge bead removal apparatus also includes an edge bead removal solvent nozzle configured to spray an edge bead removal solvent to remove edge beads on both edges of the cylindrical reticle.
Public/Granted literature
- US20170082924A1 EDGE BEAD REMOVAL APPARATUS Public/Granted day:2017-03-23
Information query
IPC分类:
