An electronic device includes a substrate, a structure arranged near the substrate and includes at least one electronic component, a conductive structure provided in the electronic device, and a conductor arranged in the structure, grounding the conductive structure to a ground of the substrate. Electronic components spaced within the electronic device are electrically connected to each other using the existing structure to be installed, so that a mounting space for preparing an electrical connector is prevented from being wasted, thereby making the electronic device slim. The embodiments according to the present disclosure can reduce the number of assembling processes and manufacturing costs.