A method for manufacturing a capacitive operation device includes the steps of: preparing a capacitance sensing member including a base film, a sensing electrode formed on the base film, a cover film, and an adhesive layer; preparing an operation panel having a recessed portion having a shape that overlaps an outer edge of the sensing electrode in a stacking direction of the operation panel and the capacitance sensing member; disposing the operation panel and the capacitance sensing member so as to face each other; and bonding the capacitance sensing member to the back surface of the operation panel by pressing the capacitance sensing member against the back surface of the operation panel. In the bonding step, the capacitance sensing member and the operation panel are bonded together while a gas therebetween is being directed to the recessed portion.