Invention Grant
- Patent Title: Integrated circuit design method
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Application No.: US15286357Application Date: 2016-10-05
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Publication No.: US09754064B2Publication Date: 2017-09-05
- Inventor: Chuan-Fang Su , Kun-Zhi Chung , Yuan-Hsiang Lung
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: G06F17/50
- IPC: G06F17/50 ; G06K9/76 ; G03F1/36

Abstract:
An IC design method includes: receiving a first layout including a first pattern; receiving a second layout including a second pattern, the first pattern separated from the second pattern when overlapping the first layout and the second layout; providing a cut pattern between the first pattern and the second pattern and overlapping the first pattern when overlapping the first layout, the second layout and the cut pattern; and providing a jog extending from the cut pattern to further overlap the first pattern with a length when a spacing between the second pattern and an edge of the cut pattern overlapping the first pattern is lower than a predetermined value, in which a ratio of the length of the jog to the spacing between the second pattern and the edge of the cut pattern overlapping the first pattern is in a range of 1/5 to 1/1.
Public/Granted literature
- US20170024507A1 INTEGRATED CIRCUIT DESIGN METHOD Public/Granted day:2017-01-26
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