Invention Grant
- Patent Title: Integrated circuit (IC) design analysis and feature extraction
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Application No.: US15048066Application Date: 2016-02-19
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Publication No.: US09754071B1Publication Date: 2017-09-05
- Inventor: Haraprasad Nanjundappa , Basanth Jagannathan , Laura S. Chadwick , Dureseti Chidambarrao , Christopher V. Baiocco
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent Michael LeStrange
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Various embodiments include approaches for analyzing integrated circuit (IC) designs. In some cases, an approach includes: defining extraction parameters for the design of the IC for each of a set of failure modes; testing the design of the IC for a failure mode in the set of failure modes; identifying a defined extraction parameter from the design of the IC for at least one of the set of failure modes; correlating the identified defined extracted parameter and each of the at least one failure mode for the design of the IC; and creating a normalized parameter equation representing the correlation of the identified defined extraction parameter with the at least one failure mode for the design of the IC in numerical form.
Public/Granted literature
- US20170242952A1 INTEGRATED CIRCUIT (IC) DESIGN ANALYSIS AND FEATURE EXTRACTION Public/Granted day:2017-08-24
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