Invention Grant
- Patent Title: Composite electronic component and board for mounting thereof
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Application No.: US14485437Application Date: 2014-09-12
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Publication No.: US09754723B2Publication Date: 2017-09-05
- Inventor: Byeong Cheol Moon , Jae Hoon Lee , Myeong Gi Kim , Jin Woo Han , Soo Hwan Son
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2014-0077159 20140624
- Main IPC: H05K7/10
- IPC: H05K7/10 ; H05K7/12 ; H01G4/40 ; H01G4/30 ; H05K1/18 ; H01F27/02 ; H01F27/29 ; H01F27/40 ; H01F27/28 ; H05K1/02

Abstract:
A composite electronic component may include a composite body including a capacitor and an inductor coupled to each other; an input terminal formed on a first end surface of the composite body and connected to the coil part of the inductor; an output terminal including a first output terminal formed on a second end surface of the composite body and connected to the coil part of the inductor and a second output terminal formed on the second end surface of the composite body and connected to the first internal electrode of the capacitor; and a ground terminal formed on a first end surface of the capacitor in the composite body. The capacitor may be coupled to a side surface of the inductor, and the sum of ratio of lengths of a short axis to a long axis of the coil part is 0.7 to 1.0.
Public/Granted literature
- US20150371780A1 COMPOSITE ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THEREOF Public/Granted day:2015-12-24
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