Invention Grant
- Patent Title: Low profile multi-anode assembly in cylindrical housing
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Application No.: US14657266Application Date: 2015-03-13
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Publication No.: US09754730B2Publication Date: 2017-09-05
- Inventor: Jan Petrzilek , Jiri Navratil , Martin Biler
- Applicant: AVX Corporation
- Applicant Address: US SC Fountain Inn
- Assignee: AVX Corporation
- Current Assignee: AVX Corporation
- Current Assignee Address: US SC Fountain Inn
- Agency: Dority & Manning, P.A.
- Main IPC: H01G9/15
- IPC: H01G9/15 ; H01G9/08 ; H01G9/032 ; H01G9/028

Abstract:
A capacitor assembly configured to effectively dissipate heat when exposed to a high ripple current is provided. The assembly includes a plurality of capacitor elements, each including an anode body and lead, a dielectric layer overlying the anode body, and a solid electrolyte. A metal cylindrical housing having a lid and base, where the lid has a diameter in an −x direction and the metal cylindrical housing has a height in a −z direction, defines an interior cavity within which the plurality of capacitor elements are arranged about a central axis running along the −z direction. The ratio of the diameter to the height of the base ranges from about 1.5 to about 20. Further, the metal cylindrical housing is hermetically sealed.
Public/Granted literature
- US20160268055A1 Low Profile Multi-Anode Assembly in Cylindrical Housing Public/Granted day:2016-09-15
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