Invention Grant
- Patent Title: Packaging method and structure
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Application No.: US15053161Application Date: 2016-02-25
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Publication No.: US09754805B1Publication Date: 2017-09-05
- Inventor: Chen-Hua Yu , Ching-Hua Hsieh , Chung-Shi Liu , Ming-Da Cheng
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/56 ; H01L21/48 ; H01L21/768
Abstract:
A system and method for manufacturing a semiconductor device are provided. In an embodiment a first semiconductor device and a second semiconductor device are encapsulated with an encapsulant. A dielectric layer is formed over the encapsulant, the first semiconductor device, and the second semiconductor device. The dielectric layer is planarized in order to reset the planarity of the dielectric layer.
Public/Granted literature
- US20170250091A1 Packaging Method and Structure Public/Granted day:2017-08-31
Information query
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