Invention Grant
- Patent Title: Systems and methods for chemical mechanical planarization with photo-current detection
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Application No.: US14855466Application Date: 2015-09-16
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Publication No.: US09754845B2Publication Date: 2017-09-05
- Inventor: I-Shuo Liu
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsinchu
- Agency: Jones Day
- Main IPC: H01L21/304
- IPC: H01L21/304 ; H01L21/66 ; B24B37/013 ; H01L21/3105
Abstract:
A method includes performing a chemical-mechanical planarization (CMP) on an article, providing a polishing fluid capable of transferring charges to the article, and detecting a current generated in response to the charges transferred to the article. An apparatus that is capable of performing the method and a system that includes the apparatus are also disclosed.
Public/Granted literature
- US20160005619A1 SYSTEMS AND METHODS FOR CHEMICAL MECHANICAL PLANARIZATION WITH PHOTO-CURRENT DETECTION Public/Granted day:2016-01-07
Information query
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