Invention Grant
- Patent Title: Circuit probing structures and methods for probing the same
-
Application No.: US14845786Application Date: 2015-09-04
-
Publication No.: US09754847B2Publication Date: 2017-09-05
- Inventor: Mill-Jer Wang , Ching-Nen Peng , Hung-Chih Lin , Hao Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L23/544 ; H01L23/00
Abstract:
A package component includes a stack-probe unit, which includes a first-type connector, and a second-type connector connected to the first-type connector. The first-type connector and the second-type connector are exposed through a surface of the package component.
Public/Granted literature
- US20150380328A1 Circuit Probing Structures and Methods for Probing the Same Public/Granted day:2015-12-31
Information query
IPC分类:
