Invention Grant
- Patent Title: Electronic device provided with an integrated conductor element and fabrication method
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Application No.: US15050253Application Date: 2016-02-22
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Publication No.: US09754851B2Publication Date: 2017-09-05
- Inventor: David Auchere , Laurent Marechal , Yvon Imbs , Laurent Schwarz
- Applicant: STMicroelectronics (Grenoble 2) SAS , STMicroelectronics (Alps) SAS
- Applicant Address: FR Grenoble FR Grenoble
- Assignee: STMicroelectronics (Grenoble 2) SAS,STMicroelectronics (Alps) SAS
- Current Assignee: STMicroelectronics (Grenoble 2) SAS,STMicroelectronics (Alps) SAS
- Current Assignee Address: FR Grenoble FR Grenoble
- Agency: Gardere Wynne Sewell LLP
- Priority: FR1557999 20150828
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/31 ; H01L21/56 ; H01L23/66 ; H01Q1/22 ; H01L21/3105 ; H01L21/48 ; H01L23/498
Abstract:
An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.
Public/Granted literature
- US20170062299A1 ELECTRONIC DEVICE PROVIDED WITH AN INTEGRATED CONDUCTOR ELEMENT AND FABRICATION METHOD Public/Granted day:2017-03-02
Information query
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