Invention Grant
- Patent Title: Sheet for sealing and method for manufacturing semiconductor device using said sheet for sealing
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Application No.: US14908687Application Date: 2014-06-30
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Publication No.: US09754894B2Publication Date: 2017-09-05
- Inventor: Chie Iino , Takeshi Matsumura , Goji Shiga , Kosuke Morita
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Knobbe Martens Olson & Bear, LLP
- Priority: JP2013-160535 20130801
- International Application: PCT/JP2014/067396 WO 20140630
- International Announcement: WO2015/015982 WO 20150205
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L23/544 ; H01L23/00 ; H01L25/00 ; H01L25/065 ; H01L23/31 ; H01L21/56 ; H01L23/29
Abstract:
Provided is a thermosetting sheet for sealing which is used to seal an electronic device. One surface of the sheet has a surface roughness (Ra) of 3 μm or less before the sheet is cured.
Public/Granted literature
- US20160211217A1 SHEET FOR SEALING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAID SHEET FOR SEALING Public/Granted day:2016-07-21
Information query
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