The reliability of a semiconductor device is improved. A semiconductor device in accordance with one embodiment has a plurality of stacked semiconductor chips. Further, a plurality of inter-chip connection members (conductive members) arranged between the semiconductor chips, and establishing an electrical connection between the semiconductor chips include a first inter-chip connection member (conductive member) for passing therethrough a current with a first frequency, and a plurality of second inter-chip connection members (conductive members) for passing therethrough a signal current with a second frequency higher than the first frequency. Further, in the second inter-chip connection members, at least some of the second inter-chip connection members arranged adjacent to each other are in contact with each other, and are separated from the first inter-chip connection member.