Invention Grant
- Patent Title: Semiconductor device
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Application No.: US15140888Application Date: 2016-04-28
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Publication No.: US09755069B2Publication Date: 2017-09-05
- Inventor: Hiroki Fujii
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2014-036944 20140227
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L29/66 ; H01L29/10 ; H01L29/40 ; H01L29/423

Abstract:
There is provided a semiconductor device having LDMOS transistors embedded in a semiconductor substrate to boost source-drain breakdown voltage, with arrangements to prevent fluctuations of element characteristics caused by electric field concentration so that the reliability of the semiconductor device is improved. A trench is formed over the upper surface of a separation insulating film of each LDMOS transistor, the trench having a gate electrode partially embedded therein. This structure prevents electric field concentration in the semiconductor substrate near the source-side edge of the separation insulating film.
Public/Granted literature
- US20160240664A1 SEMICONDUCTOR DEVICE Public/Granted day:2016-08-18
Information query
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